Staff Packaging Engineer
Core
Develop and optimize semiconductor packaging solutions from silicon die through PCB-level integration, supporting advanced packaging development, structural/thermal analysis, and manufacturing readiness.
Role type
Staff IC packaging engineer (semiconductor)
Builds
Semiconductor packages (2.5D/3D integration, hybrid bonding) for AI datacenters, chip design, and consumer electronics
Domain
Semiconductor manufacturing / Advanced packaging
Required skills
Semiconductor package development, Structural and thermomechanical simulation (FEA), Assembly process optimization, Failure analysis, Cross-functional collaboration, Manufacturing readiness
Preferred skills
PhD in relevant engineering, Advanced packaging (TSV, fan-out, chiplets, heterogeneous integration), Experience with CMs/OSATs, SI/PI fundamentals
Technologies
ANSYS, FEA tools, EDA tools
Responsibilities
Define package stack-ups and interface requirements, Perform structural and thermal simulations, Develop assembly processes (flip-chip, die attach, molding), Execute qualification plans per JEDEC standards, Support root cause analysis for reliability issues, Collaborate with R&D, suppliers, and customers
Seniority
Staff, hands-on IC with mentorship