Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering
Core
Develop and optimize assembly processes for advanced packaging technologies, including wafer-level packaging and die stacking (Chip on Wafer, Chip to Wafer), to improve product quality, yield, and productivity.
Role type
Process Development Engineer (Advanced Packaging)
Builds
Semiconductor memory and storage products (DRAM, NAND, NOR) via advanced packaging solutions.
Domain
Semiconductor manufacturing / Advanced Packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Process development, yield improvement, cost reduction, process parameter setup, data analysis, stakeholder collaboration, product transfer management
Preferred skills
Semiconductor industry experience, Python, R, SQL for statistical analysis, Visual Basic for automation
Technologies
Semiconductor equipment, wafer-level packaging tools, die stacking equipment
Responsibilities
Develop and optimize assembly processes for advanced packaging technologies; Evaluate and promote new equipment and materials; Establish correlations between defense mechanisms to identify improvement opportunities; Provide Process Of Record (POR) and Model Of Record (MOR) documentation for product transfer to production.
Seniority
Mid-level IC
