Senior Materials Engineer / Scientist
Core
Develop, characterize, qualify, and integrate advanced materials supporting next-generation memory and packaging technologies.
Role type
Senior IC materials engineer/scientist (semiconductor packaging)
Builds
Next-generation memory and packaging technologies (HBM, 3D memory, heterogeneous integration)
Domain
Semiconductor manufacturing / Advanced packaging
Required skills
Materials science fundamentals, experimental design and execution, data analysis, hypothesis generation, cross-functional collaboration, supplier engagement, patent/invention disclosure, AI tool adoption
Preferred skills
Experience with polymers, dielectrics, adhesion materials, thermal materials, digital modeling and simulation
Technologies
AI tools, digital modeling, simulation, data analytics
Responsibilities
Develop and qualify materials for memory and packaging; design and execute experiments to solve technical problems; collaborate with process, manufacturing, and supplier teams; contribute to patents and technical publications; leverage AI tools for materials development
Seniority
Senior, hands-on IC