Package Development, Signal Integrity and Power Integrity Engineer, Principal
Core
Develop advanced microelectronic packages for semiconductors supporting 448 Gb/s data rates, focusing on signal and power integrity, electrical design, and modeling.
Role type
Principal high-speed IC package development engineer
Builds
Advanced microelectronic packages for data infrastructure
Domain
Semiconductor / High-speed digital and analog ICs
Required skills
EM simulation (Ansys HFSS, SI-Wave, Cadence Clarity), IC package layout (APD, PADS), 2.5D/3D package development, SI/PI analysis, VNA/TDR measurements, high-speed signaling theory, circuit design (Spectre, ADS, HSpice), Python scripting, power plane design, EMI/EMC debugging
Preferred skills
Co-Packaged Optics, thermal/mechanical analysis, channel simulations (MATLAB)
Technologies
Ansys HFSS, SI-Wave, Cadence Clarity, APD, PADS, Spectre, ADS, HSpice, PowerSI, MATLAB, Python
Responsibilities
Interface with package suppliers to select technology and drive layout; develop achievable package specs with marketing and IC designers; ensure manufacturability and compliance with performance/reliability/cost requirements; manage cross-functional teams for assembly and layout; perform electrical design, modeling, and characterization.
Seniority
Principal, hands-on IC
