Sr. Staff, Signal Integrity and Power Integrity Engineer
Core
Develop advanced microelectronic packages for semiconductors supporting 448 Gb/s data rates, focusing on signal and power integrity, electrical design, and modeling.
Role type
Senior IC package development engineer (high-speed)
Builds
Advanced microelectronic packages for enterprise, cloud, and AI architectures
Domain
Semiconductor / High-speed digital and analog IC packaging
Required skills
EM simulation (Ansys HFSS, SI-Wave, Cadence Clarity), IC package layout (APD, PADS), 2.5D/3D package development, SI/PI analysis, Python scripting, VNA/TDR measurements, high-speed signaling theory, power plane design, EMI/EMC debugging
Preferred skills
Co-Packaged Optics experience, thermal/mechanical analysis, channel simulations (MATLAB, ADS), new product introduction track record
Technologies
Ansys HFSS, SI-Wave, Cadence Clarity, APD, PADS, Spectre, ADS, HSpice, PowerSI, MATLAB
Responsibilities
Package development, electrical design, modeling, and characterization; interface with package suppliers to select technology and ensure manufactability; collaborate with IC designers and marketing to develop package specs; automate SI, PI, and packaging activities using scripting
Seniority
Senior, hands-on IC
