Package Design, Signal and Power Integrity Senior Staff Engineer
Core
Develop advanced microelectronic packages for semiconductors supporting 448 Gb/s data rates and beyond, focusing on high-speed interface design, power delivery, and signal integrity.
Role type
Senior Staff IC package design engineer (SI/PI)
Builds
Advanced IC packages for data infrastructure (enterprise, cloud, AI, carrier architectures)
Domain
Semiconductor / High-speed electronics / Advanced packaging
Required skills
Transmission line theory, EM fundamentals, frequency and time domain analysis, SI/PI design, 2-D/3-D EM simulation, power plane design, channel/circuit simulation, lab measurements (VNA, TDR), layout tools
Preferred skills
Packaging technologies, thermal/mechanical analysis, 2.5D/3D package development, CPC/CPO connectors, Python scripting for automation
Technologies
Ansys HFSS, SI-Wave, Cadence Clarity, PowerSI, ADS, Hspice, Allegro, APD, PADS
Responsibilities
Package interconnect design, modeling, and characterization; develop simulation methodology and correlate with measurements; explore new interconnect architectures and develop design rules; investigate channel/PDN behavior and establish root-cause; manage cross-functional package development
Seniority
Senior Staff, hands-on IC
