Advanced Packaging Senior Engineer
Core
Senior engineer driving semiconductor IC package development from concept to mass production, supporting customers with advanced custom package designs meeting challenging electrical requirements.
Role type
Senior IC packaging engineer (2.5D/3D)
Builds
Advanced semiconductor packages (CoWoS-S/R/L, EMIB, CPO, CPC) for data infrastructure, enterprise, cloud, AI, and carrier architectures.
Domain
Semiconductor manufacturing / Advanced Packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
IC package design, PCB layout, electrical simulation interpretation, flip chip design, 2.5D/3D packaging technology, package substrate design rules, assembly rules, tool evaluation, flow development, library maintenance
Preferred skills
Hands-on design experience on flip chip packages, 2.5D or 3D
Technologies
Cadence APD, Xpedition Package Designer
Responsibilities
Evaluate design feasibility based on package topology and electrical requirements; perform hands-on physical implementation of package design; interact with electrical simulation team to optimize designs; collaborate with operations and fabrication suppliers for design for manufacturing; execute layout tasks including tool evaluations and library maintenance
Seniority
Senior, hands-on IC
