Principal / Senior/ Engineer, Package Characterization - APTD
Core
Advanced Packaging Characterization Engineer providing package development characterization and failure analysis support for development test vehicles, qualifications, customer returns, and new product introductions.
Role type
Senior IC failure analysis engineer (advanced packaging)
Builds
Advanced packaging technology solutions for memory and storage products
Domain
Semiconductor manufacturing / Advanced Packaging
Required skills
Failure analysis methodologies, Plasma FIB, SEM, EDX, TEM, AFM, FTIR, XPS, X-ray, CSAM, Ion Milling, delayering, decapsulation, electrical fault analysis, root cause analysis, lab management, equipment calibration, cross-sectioning, die-stacked characterization
Preferred skills
AI-assisted tools integration, technical mentoring, industry conference participation, vendor engagement
Technologies
Plasma FIB, SEM, EDX, TEM, AFM, FTIR, XPS, X-ray, CSAM, Ion Milling
Responsibilities
Perform electrical fault analysis to pinpoint hotspots on advanced packages; Perform precision cross-section on hotspot location using Plasma FIB; Conduct TMO training and FA certification; Manage laboratory to comply with TS, ISO14001 and OHSAS requirements; Coordinate calibrations and equipment repair; Document failure analysis techniques used to isolate failure for other groups (via careerplan.io/jobs/39328938-principal-senior-engineer-package-characterization-aptd-at-micron)
Seniority
Senior, hands-on IC
