ASIC Package Engineer
Core
Perform mechanical and thermomechanical simulations of ASICs and complex silicon packages to ensure reliability and accelerate product design.
Role type
Senior IC ASIC Mechanical Engineer
Builds
High-performance Cisco systems
Domain
Semiconductor packaging and thermal engineering
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Finite element analysis (FEA), thermomechanical simulation, 3D modeling, material behavior analysis (plasticity, creep, viscoelasticity), solder joint reliability assessment, Python/Fortran scripting for automation, root cause analysis, design optimization, failure investigation, documentation
Preferred skills
Advanced packaging (flip chips, 2.5D/3D, heterogeneous integration), CAD/GD&T (AutoCAD, Creo), JEDEC/IPC standards, material characterization, reliability qualification
Technologies
ABAQUS, ANSYS, Python, Fortran, AutoCAD, Creo
Responsibilities
Perform FEA to evaluate thermal mechanical stress, warpage, and solder joint reliability; Simulate linear/nonlinear material behaviors; Develop and automate simulation workflows; Provide simulation results to support design and risk mitigation; Support design optimization and failure investigations; Document and present analysis results and recommendations
Seniority
Senior, hands-on IC
