Thermal Mechanical Engineer
Core
Performing structural and thermal simulations to optimize the design of electro-optical sub-assemblies for quantum computer systems.
Role type
Senior IC thermal mechanical engineer (quantum computing)
Builds
Quantum computer sub-systems and electro-optical modules
Domain
Quantum computing / Silicon photonics / Semiconductor manufacturing
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
FEA/CFD modeling, thermal conduction and convective heat transfer, solid mechanics (stress, strain, fatigue, creep), nonlinear and transient analysis, multi-material warpage analysis, reliability modeling (thermal cycling, mechanical fatigue), requirements management, FMEA, tolerance analysis
Preferred skills
Ansys AEDT, Ansys Sherlock, advanced semiconductor packaging knowledge, solder joint reliability modeling, optical system specifications, SOC thermal mechanical analysis, optical structural analysis
Technologies
ANSYS (Mechanical, Icepak, Fluent), COMSOL
Responsibilities
Develop detailed FEA/CFD models of components and system-level assemblies; Correlate simulation results with experimental measurements and prototype data; Perform warpage and deformation analysis for multi-material assemblies; Develop thermal cycling and mechanical fatigue models to predict long-term reliability; Identify mechanical risk drivers and recommend design or material changes; Analyze failures related to electro-optical assembly design; Develop end-to-end simulation workflows to automate processes and improve efficiency
Seniority
Senior, hands-on IC