Advanced Package Development Engineer

San Francisco Bay Area, United States of AmericaFull-time2026-11-02 → 2026-11-10

Core

Drive advanced packaging integration and technology development for next-generation silicon products, enabling industry-leading performance.

Role type

Senior IC advanced packaging development engineer

Builds

Next-generation silicon products with advanced packaging solutions (2.5D/3D, hybrid bonding, high-density interconnects)

Domain

Semiconductor manufacturing / Advanced packaging

Deliverable

production ML models

Required skills

Advanced packaging architectures, foundry process definition, GDS/layout review (DRC/LVS), statistical data analysis, failure analysis, AI/ML for process optimization

Preferred skills

MS/PhD in relevant field, experience with IC layout tools (Calibre, Virtuoso, KLayout), thermo-mechanical physics, multi-domain interactions, NPI engineering builds

Technologies

Calibre, Virtuoso, KLayout, GDSII, OASIS

Responsibilities

Define specs and process windows for advanced packaging solutions; Lead test vehicle definition, floorplanning, and tapeout execution; Perform layout and GDS/mask review ensuring DRC/LVS compliance; Drive failure analysis and root-cause investigations; Apply AI/ML techniques to analyze metrology datasets for process optimization

Seniority

Senior, hands-on IC

About Apple

Computers and Electronics Manufacturing194620Cupertino, California, USFounded 1976

We’re a diverse collective of thinkers and doers, continually reimagining what’s possible to help us all do what we love in new ways. And the same innovation that goes into our products also applies to our practices — strengthening our commitment to leave the world better than we found it. This is where your work can make a difference in people’s lives. Including your own. Apple is an equal opportunity employer that is committed to inclusion and diversity. Visit apple.com/careers to learn more.