IC Package design engineer- 4+ Years
Core
Lead package design tasks from concept through implementation for high-performance networking ASICs.
Role type
Senior IC package design engineer
Builds
High-speed, robust, and scalable silicon package solutions for global networks
Domain
Semiconductor / Networking
Required skills
Package layout design, High-speed layout design (PCIe, DDR, SerDes), Cadence APD tool proficiency
Preferred skills
Multi-die package design, Interposer design
Technologies
Cadence APD, PCIe, DDR, SerDes
Responsibilities
Lead package design tasks and drive schedules from concept to implementation, Optimize package pinouts, stack-ups, power distribution, and high-speed routing, Collaborate with silicon floor planning, signal integrity, and power integrity teams, Work with layout editors to deliver high-quality package designs, Enhance design methodologies and partner with vendors, Drive innovation in package solutions for next-generation ASICs
Seniority
Senior, hands-on IC with mentorship responsibilities
