Senior Ingenieur / Physiker Semiconductor Packaging (w/m/d)
Core
Develop and implement customer-specific adhesive solutions for microelectronic packaging and process integration in the semiconductor industry.
Role type
Senior IC application engineer (semiconductor packaging)
Builds
Custom adhesive solutions and process integration for semiconductor customers
Domain
Semiconductor manufacturing / Adhesive technology
Required skills
Semiconductor packaging expertise, process engineering, technical consulting, feasibility studies, cross-functional collaboration
Preferred skills
Project management, international travel readiness, advanced English (via careerplan.io/jobs/19816-JR1000370-31818-S-senior-ingenieur-physiker-semiconductor-packaging-wmd-at-delo-industrie-klebstoffe-gmbh-co)
Technologies
Adhesive technologies, microelectronic packaging processes
Responsibilities
Solve complex adhesive technical tasks in microelectronic packaging, develop customer-specific solutions up to process integration, provide technical consulting to international customers, implement technologies in customer manufacturing processes, conduct feasibility studies, expand technical expertise
Seniority
Senior, hands-on IC