Wire Bond-Manufacturing Engineer
Core
Develop, qualify, optimize, and sustain wire bonding processes and equipment for semiconductor packaging operations to ensure high yield, reliability, and throughput.
Role type
mid-to-senior IC manufacturing engineer (wire bonding process & equipment)
Builds
semiconductor packages (ball, wedge, ribbon bonding)
Domain
semiconductor assembly & test / photonics infrastructure
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
wire bonding process development, equipment troubleshooting, root cause analysis, DOE, SPC, CAPA, failure analysis, process qualification, standard compliance (JEDEC/MIL-STD-883)
Preferred skills
copper wire bonding, fine-pitch bonding (<50 µm), stacked die bonding, Six Sigma certification, statistical software (Minitab/JMP), cleanroom experience
Technologies
ASM, Kulicke & Soffa, Shinkawa, Hesse, West Bond
Responsibilities
Develop and optimize wire bond processes for gold, copper, and aluminum; troubleshoot and optimize wire bonding equipment uptime and throughput; lead equipment qualification and preventive maintenance; perform wire pull and ball shear testing; partner with Quality on failure analysis and reliability testing; support NPI with new process flows and DOE-driven windows.
Seniority
mid-to-senior, hands-on IC
