Process Engineer (Die Attach / Wire Bond / Active Alignment / Overall Line)
Core
Develop, qualify, and optimize high-precision microelectronics packaging and optical module assembly processes for volume manufacturing ramp-up.
Role type
Senior IC Process Engineer (Semiconductor Packaging/Optical Module Assembly)
Builds
Optical interconnects, photonic engines, and high-precision automation lines for AI supercomputing infrastructure.
Domain
Semiconductor packaging, microelectronics, optical module manufacturing, photonics.
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Process development and qualification, yield optimization, 8D root-cause failure analysis, Statistical Process Control (SPC), Design of Experiments (DOE), FMEA, Cpk analysis, line balancing, cleanroom protocols, GD&T, structured problem-solving (5-Why, Fishbone)
Preferred skills
Experience with epoxy/eutectic dispense, high-precision pick-and-place, flip-chip bonding, ball/wedge wire bonding, multi-axis optical alignment, collimation, laser/lens positioning, UV cure dispensing
Technologies
JMP, Minitab
Responsibilities
Establish robust process windows, parameter recipes, and SOPs for production modules; monitor line yield metrics and lead defect reduction initiatives; partner with NPI and Equipment Engineering to qualify new tooling and materials; apply SPC and DOE to drive process stability and cost-efficiency; collaborate with operators and quality engineers to resolve line stops.
Seniority
Mid-level, hands-on IC
