Process Technician

Chon Buri💼 Full-time🗓 2026-09-10 → 2026-09-26

Core

Support die attach, wire bonding, and epoxy dispensing processes for semiconductor and photonics assembly in NPI and production environments.

Role type

Die Attach & Wire Bond Process Technician

Builds

Optical interconnects, photonic engines, and silicon photonics modules

Domain

Semiconductor packaging and silicon photonics manufacturing

Deliverable

Required skills

Au wire bonding, conductive/non-conductive die attach epoxy, eutectic die bonding, die shear/wire pull/ball shear inspection, SPC, DOE, manufacturing process control

Preferred skills

Experience with K&S, Besi, Palomar, Datacon, Nordson equipment

Responsibilities

Machine setup, recipe loading, tooling change, process monitoring, epoxy dispensing, die placement, curing, visual inspection, equipment troubleshooting, preventive maintenance, process parameter verification, recording process data and defects, supporting yield improvement and root-cause analysis

Seniority

Mid-level, hands-on IC

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About Lumilens

At Lumilens we are building the critical photonics infrastructure that powers tomorrow’s AI supercomputing. From chip-to-chip optical interconnects to scalable photonic engines, Lumilens is unlocking a new era of computing faster, cooler, and massively more efficient.We’re a well-funded startup backed by Mayfield and led by veterans who’ve built and scaled some of the most transformative technologies in the industry. This isn’t incremental innovation, it’s a ground-floor opportunity to rethink the optical layer from the silicon up. You’ll work alongside a team of world-class engineers solving