Principal Packaging Engineer
Core
Lead the design and electrical characterization of advanced high-speed IC packages for Datacenter connectivity products, bridging silicon and system through package design and signal integrity engineering.
Role type
Principal IC Package Design and Signal Integrity Engineer
Builds
High-performance mixed-signal ICs for data communications and video broadcast industries
Domain
Semiconductor / High-speed Datacenter connectivity
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
High-speed transmission line theory, multi-domain power delivery network (PDN) design, package-level signal integrity, EDA tooling (Keysight ADS, Cadence APD/SiP, Ansys HFSS), RF/SI measurement (VNA, TDR), advanced packaging technologies (2D/2.5D/3D, FOCOS, COB), NPI lifecycle management, supplier relationship management
Preferred skills
Optoelectronics package design, photonic integration, Datacenter product development (400G/800G/1.6T), thermo-mechanical simulation, reliability engineering methodologies, fabless semiconductor environment experience
Technologies
Keysight ADS, Cadence APD/SiP, Ansys HFSS, VNA, TDR, FOCOS, COB, Silicon bridge interconnects
Responsibilities
Design high-speed IC packages and Chip-On-Board (COB) solutions; Perform 3D signal integrity modeling and experimental validation; Prepare technical reports and application notes on SI/PI and assembly processes; Design and produce PCB and high-density substrate layouts; Serve as technical interface with manufacturing suppliers during NPI; Identify and launch projects with new strategic suppliers; Mentor junior packaging engineers
Seniority
Principal, hands-on IC with mentorship
