Principal Product Enigneer - Integrity 3D-IC/Innovus
Core
Develop design flows for leading-edge 3D IC designs using Cadence Integrity 3D-IC and Innovus platforms, focusing on system-level planning and physical implementation.
Role type
Principal Product Engineer (3D-IC/Physical Design)
Builds
Design flows for 3D IC integration covering system-level planning, physical implementation, timing/PSI/thermal analysis, and physical verification.
Domain
Semiconductor EDA / 3D IC Integration
Required skills
ASIC digital implementation, EDA physical design tools, system-level planning, physical implementation, customer engagement, R&D collaboration, competitive analysis, script languages (Tcl, Perl, Python), advanced package design knowledge, deep sub-micron design solutions
Preferred skills
MS in EE/CS/CompE, 10+ years ASIC experience, deep 3D integration methodology knowledge, advanced package design challenges expertise
Technologies
Cadence Integrity 3D-IC, Innovus, Tcl, Perl, Python
Responsibilities
Understand customer design specifications and challenges in advanced package designs, develop and validate new design flows with internal R&D and field engineering teams, provide field intelligence and customer feedback to align product development with technical needs
Seniority
Principal, hands-on IC with strategic customer alignment
