Senior Engineer, Semi Packaging Engineering
Core
Develop advanced integrated circuit packaging solutions including design, material selection, qualification, and release-to-manufacturing for semiconductor products.
Role type
Senior IC Packaging Engineer
Builds
Semiconductor IC packages and related manufacturing processes
Domain
Semiconductor manufacturing / Mechanical Engineering
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
3D CAD tools (SolidWorks), FEA software (ANSYS), IC package design, optimization, and manufacturing, IC package reliability requirements, failure analysis techniques, assembly process issues, manufacturing control plan, process failure mode and effects analysis (FMEA), statistical process control (SPC), design of experiment (DOE), CAD tools (AutoCAD)
Preferred skills
None stated
Technologies
SolidWorks, ANSYS, AutoCAD
Responsibilities
Develop advanced integrated circuit packaging solutions including design, material selection, qualification, and release-to-manufacturing; Perform component or system level mechanical stress and thermal simulations; Manage projects through development of design iterations, substrate layout/simulation, assembly of prototype, and qualification; Document manufacturing process flows and control plans for IC packages at external suppliers; Work with quality and reliability groups to establish reliability criteria and qualification plan for various end applications
Seniority
Senior, hands-on IC
