Sr. Module Engineer, Hybrid Bonding
Core
Develop and scale next-generation die-to-wafer hybrid bonding processes for advanced semiconductor packaging applications including Memory, chiplets, AI accelerators, and heterogeneous integration platforms.
Role type
Senior IC process module engineer (hybrid bonding)
Builds
Next-generation 3D integration and HBM stacking solutions for high-bandwidth, energy-efficient computing systems
Domain
Semiconductor manufacturing / Advanced packaging / Materials science
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Hybrid bonding process development, Cu-Cu and dielectric-dielectric interconnect formation, Surface preparation and plasma activation, Die placement and alignment control, Post-bond annealing and characterization, Yield improvement via DOE and SPC, Reliability test planning and failure analysis, Cross-functional technical leadership
Preferred skills
HBM or 3D stacking technology experience, Direct bonding interconnect (DBI) expertise, Die placement system knowledge, AI/HPC packaging architecture familiarity, 200mm/300mm wafer manufacturing experience, Patent or publication record
Technologies
CSAM, X-ray inspection, FIB/SEM, AFM, Optical metrology, JMP/Minitab, CMP tools, Plasma activation modules
Responsibilities
Develop and optimize die-to-wafer hybrid bonding processes; Establish process windows for surface preparation, activation, placement, and bonding; Drive Cu-Cu and dielectric-dielectric interconnect formation; Support integration into memory, chiplet, and Co-packaged optics architectures; Identify root causes of bond voids, die shift, and overlay errors; Drive bonding quality characterization using metrology tools; Define and execute reliability test plans; Lead cross-functional projects from concept to technology transfer
Seniority
Senior, hands-on IC with technical leadership
