Process Engineer-Shanghai/Hangzhou/Hefei/Nanjing/Suzhou/Wuxi
Core
Designing and optimizing manufacturing processes for display and semiconductor technologies, specifically focusing on advanced packaging.
Role type
Senior IC Process Engineer (Advanced Packaging)
Builds
Advanced packaging modules and FabVantage value-added solutions for semiconductor and display customers
Domain
Semiconductor manufacturing / Advanced Packaging
Required skills
Advanced packaging process expertise, CMP, Etch, HBM, 2.5D/3D packaging, high-density interconnects, data analytics, DOE, statistical analysis, root cause analysis, hardware characterization
Preferred skills
AIx databases, digital FabVantage platforms, JMP, Applied Pro
Technologies
JMP, FSS, AIx, FabVantage
Responsibilities
Lead advanced packaging process engagements with China-based customers; Identify, analyze, and resolve high-value process and integration issues; Define and implement best practices for advanced packaging modules; Drive knowledge capture by documenting findings and delivering presentations; Utilize techniques to characterize hardware on complex systems; Develop, plan, and execute process engineering projects within safety guidelines
Seniority
Senior, hands-on IC