Advanced Packaging Integration Engineer
Core
Lead process integration for high-performance interconnects and microLED panels, architecting scalable flows for manufacturability and reliability in silicon photonics packaging.
Role type
Advanced Packaging Integration Engineer
Builds
High-performance optical interconnects and co-packaged optics via 3D integration solutions
Domain
Semiconductor manufacturing / Silicon photonics / Advanced packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Advanced packaging technologies (wafer-to-wafer/die-to-wafer hybrid bonding, 2.5D/3D integration, TSV, RDL, underfill, bumping, molding, OSAT processes), DOE/SPC statistical analysis, root-cause analysis, cross-functional collaboration with foundries and OSATs
Preferred skills
Coding, MES systems, executive-level presentation skills
Technologies
JMP, MES systems
Responsibilities
Define and optimize advanced packaging process integration flows (3D heterogeneous integration, die stacking, hybrid bonding), lead complex technical programs and resolve challenges, design controlled experiments and interpret data, collaborate with foundries and OSATs to implement improved methodologies, track industry advancements to drive innovation
Seniority
Mid-to-Senior, hands-on IC
