Engineer, Process Development Engineering
Core
Develop, qualify, and optimize Die Attach and Flip Chip assembly processes for semiconductor packaging.
Role type
Process Development Engineer (semiconductor packaging)
Builds
Semiconductor packages (Die Attach, Flip Chip, Underfill, Solder bump)
Domain
Semiconductor manufacturing / Advanced packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Die bonding techniques, Flip chip assembly, Underfill processes, Solder bump / micro-bump technology, DOE (Design of Experiments), Failure analysis, Equipment qualification, Process documentation, Continuous improvement
Preferred skills
Advanced packaging technologies (WLCSP, BGA, SiP, 2.5D/3D packaging)
Technologies
ASM, BESI, Datacon
Responsibilities
Develop and optimize Die Attach and Flip Chip assembly processes, Provide process engineering support for production lines, Perform process characterization and DOE, Support new product introduction (NPI), Resolve process-related issues with cross-functional teams, Establish and maintain process documentation, Drive continuous improvement initiatives, Analyze failure modes and reliability concerns, Interface with equipment vendors and material suppliers, Ensure compliance with quality standards
Seniority
Mid-Senior, hands-on IC
