Engineer, Process Development Engineering
Core
Develop, qualify, and optimize Die Attach and Flip Chip assembly processes for semiconductor packaging.
Role type
Process Development Engineer (semiconductor packaging)
Builds
Semiconductor packages (Die Attach, Flip Chip, Underfill, Solder bump)
Domain
Semiconductor manufacturing / Advanced packaging
Required skills
Die bonding techniques, Flip chip assembly, Underfill processes, Solder bump / micro-bump technology, DOE (Design of Experiments), Failure analysis, Equipment qualification, Process documentation, Continuous improvement
Preferred skills
Advanced packaging technologies (WLCSP, BGA, SiP, 2.5D/3D packaging), Reliability testing
Technologies
ASM, BESI, Datacon
Responsibilities
Develop and optimize Die Attach and Flip Chip assembly processes, Provide process engineering support for production lines, Perform process characterization and DOE, Support new product introduction (NPI), Resolve process-related issues with cross-functional teams, Establish process documentation and control plans, Analyze failure modes and reliability concerns, Interface with equipment vendors and material suppliers, Ensure compliance with quality standards
Seniority
Mid-Senior, hands-on IC
