芯片贴装工艺工程师/Die Attach Process Engineer
Core
Manage mass production processes, parameter tuning, and optimization for semiconductor die attach (chip bonding) operations.
Role type
Die Attach Process Engineer
Builds
Semiconductor packages and power devices
Domain
Semiconductor manufacturing / Packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Semiconductor packaging process knowledge, yield improvement, root cause analysis, FMEA, SOP development, NPI introduction, cross-functional collaboration, cleanroom standards, shift work adaptability
Preferred skills
Power device experience, automotive chip experience, flip chip technology, SMT placement knowledge, familiarity with die attach equipment logic
Technologies
Die attach equipment, SMT equipment
Responsibilities
Control mass production parameters and optimize die attach processes; Lead yield improvement and resolve defects like misalignment, voids, and drop-outs; Develop and update process specifications and SOPs; Validate materials and conduct compatibility tests for new products; Collaborate with equipment, quality, and production teams to solve manufacturing issues