ENGR STAFF, PACKAGE DEV; PKG&ASSY
Core
Lead the development, optimization, and qualification of wirebond processes for new and existing semiconductor packages to ensure robust manufacturability and reliability.
Role type
Staff Package Development Engineer
Builds
Semiconductor packages (wirebond technology)
Domain
Semiconductor manufacturing / Package assembly
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Wire bond equipment and process knowledge, Six Sigma methodology, DMAIC approach, Statistical analysis, Design of Experiments (DOE), Process characterization, JMP software, Minitab software
Preferred skills
None stated
Technologies
Wire bond equipment, JMP, Minitab
Responsibilities
Lead development and optimization of wirebond processes, Support NPD qualification and high-volume manufacturing, Perform characterization and optimization studies independently, Communicate technical issues and provide improvement timelines with RCCA definition
Seniority
Staff, hands-on IC