Senior Flip Chip Manufacturing Process Engineer
Core
Drive continual improvement in flip chip manufacturing processes, specifically die attach, reflow, and flux wash operations to enhance efficiency, yield, and quality.
Role type
Senior IC manufacturing process engineer (flip chip)
Builds
Flip chip semiconductor packages
Domain
Semiconductor manufacturing / Electronics
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Statistical process control, Engineering change control, Process release strategies, Data analytic applications, Process optimization, Team leadership, Specification documentation, Material definition (flux, solder paste, bumps), Equipment setup (ASM Die Bonder, reflow, fluxwash), Statistical analysis tools (Excel, Minitab, Spotfire, JMP), Quality tools (FTA, Fish Bone, 8D, RCA, DMAIC)
Preferred skills
None explicitly stated as preferred capabilities; listed items are knowledge requirements or soft skills.
Technologies
ASM 8312+, ITEC ADAT, Excel, Minitab, Spotfire, JMP
Responsibilities
Develop and implement improved manufacturing methods and procedures, optimize process parameters and recipe standardization, support die attach processes for customer deliverables, define applicable die attach materials, define statistical and automated monitoring methods, support reflow and flux wash processes, implement project or improvement plans for efficiency/cost/quality, identify systematic problems in process or equipment, support manufacturing ramp with equipment startup and process experiments, supervise and lead a team of process technicians
Seniority
Senior, hands-on IC