Advanced Package Technology Engineer

USA-CA San Jose Innovation DriveFull-time2026-11-02 → 2026-11-10

Core

Lead the development of cost-effective, high-performance 2.5D and 3D advanced custom packaging solutions for ASIC products, ensuring signal integrity, thermal, and structural reliability.

Role type

Senior IC advanced package technology engineer

Builds

Advanced packaging solutions (2.5D/3D, heterogeneous integration) for ASIC products

Domain

Semiconductor manufacturing / Advanced packaging

Required skills

2.5D/3D package development, heterogeneous integration, flip-chip packaging, multi-layer ceramic/organic substrates, interposers, wafer-level packaging, thermal-mechanical modeling, failure analysis, BOM definition, supplier evaluation

Preferred skills

None stated

Technologies

APD, AutoCAD, SolidWorks

Responsibilities

Define customer needs and consolidate requirements for packaging solutions; lead identification, development, and qualification of advanced packaging solutions; interface with internal technical teams (Design Integration, Package Design, Test Development); support NPI and high-volume manufacturing ramps

Seniority

Senior, hands-on IC

About Broadcom

Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.