R&D Engineer
Core
Technical lead for multi-chip semiconductor assembly and system pathfinding for leading-edge AI and high-performance computing modules.
Role type
Senior R&D Engineer (Advanced Packaging & System Integration)
Builds
Advanced packaging and assembly technologies for AI and HPC modules
Domain
Semiconductor manufacturing, advanced packaging, system-in-package
Deliverable
production ML models | product features | infrastructure
Required skills
Advanced packaging technology, system-in-package assembly, manufacturability analysis, reliability failure mechanisms, assembly process development, wafer foundry operations, thermal solutions, power delivery, electrical/optical communication interfaces, parametric and yield data analysis, statistical data analysis tools, yield failure root cause analysis (EFA, PFA), thermal and stress simulation
Preferred skills
Independent project management, cross-functional technology risk mitigation, design and product enablement
Technologies
EFA, PFA, statistical data analysis tools, thermal and stress simulation tools
Responsibilities
Define technology requirements and roadmaps, evaluate and qualify new assembly technologies, provide hands-on applications support during process transitions, solve advanced packaging technology problems, serve as principal investigator for new technology projects, coordinate cross-functional risk mitigation for parallel projects
Seniority
Senior, hands-on IC with strategic roadmap ownership