R&D Process Engineer
Core
Design and implement packaging processes for new optocoupler isolation products, optimizing manufacturing yield, quality, and reliability.
Role type
R&D Process Engineer (Semiconductor Packaging)
Builds
New optocoupler isolation devices
Domain
Semiconductor manufacturing / Optocoupler packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Mechanical engineering, semiconductor packaging process development, Die Attach, Wire Bonding, Encapsulation/Molding, Package Trim & Form, Vision Inspection tools, mechanical leadframe design, physical failure analysis, IC packaging, high-voltage isolation, NPI project leadership, CAD and simulation tools
Preferred skills
NPI project leadership from verification to high-volume soft launch
Technologies
Solidworks, Ansys
Responsibilities
Design and implement packaging processes for new isolation products, Evaluate material reliability and processing techniques, Conduct Design of Experiments (DOE) and optimize processes, Perform process yield analysis and failure investigations, Plan and execute engineering programs for cost reduction and yield improvement
Seniority
Experienced, hands-on IC
