焊线工艺&设备工程师/Wire Bond Process and Equipment Engineer
Core
Optimizing wire bonding process parameters and managing equipment operations to ensure yield and quality in semiconductor packaging.
Role type
Wire Bond Process and Equipment Engineer
Builds
Semiconductor packaging products
Domain
Semiconductor manufacturing / Packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Wire bonding process optimization, Yield management, Equipment maintenance and calibration, New product introduction (NPI), Root cause analysis (8D reports), Cross-functional collaboration, Cleanroom compliance
Preferred skills
Ball shear and pull test operation, Knowledge of wire bonding industry standards
Technologies
Wire bonding machines, Office software
Responsibilities
Optimize wire bonding parameters for gold/aluminum/copper wires, Manage equipment maintenance and fault repair, Conduct new product introduction and process validation, Close loop on process and equipment issues, Improve equipment utilization rates
Seniority
Mid-level, hands-on IC
