Advanced Packaging Development Engineer
Core
Develop and enable advanced packaging technology to integrate memory dies and SoC dies into one package for AI-related products.
Role type
Advanced Packaging Development Engineer
Builds
AI accelerator and networking chips with integrated memory and SoC dies
Domain
Semiconductor / Advanced Packaging / AI Hardware
Deliverable
production ML models | product features | infrastructure
Required skills
2.5D/3D packaging technology, HBM technology, iVR technology, Si Cap technology, reliability testing, yield improvement, technology roadmap planning, project management
Preferred skills
technology innovation, development, and enablement
Technologies
HBM, iVR, Si Cap, 2.5D/3D packaging
Responsibilities
Define packaging technology roadmap for future product needs (3-5 years), support development of key components (HBM, iVR, Si Cap), manage reliability tests to qualify new technology, lead yield improvement activities for new technology ramp-up
Seniority
Senior, hands-on IC