Substrate/Package Layout Engineer
Core
Design and layout advanced substrates and IC packages, including high-speed lines and interposers, ensuring functionality and performance.
Role type
IC Substrate and Package/Interposer Layout Engineer
Builds
High-speed RF substrates, IC packages, and interposers for semiconductor products
Domain
Semiconductor manufacturing, RF design, and electronic packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Cadence layout tools (Allegro, Innovus, Virtuoso), Electronic Design Automation (EDA), multilayer high-speed RF design, package/substrate manufacturing processes, surface mount technology, script-based layout tools, DRC, LVS
Preferred skills
Simulation of designs, improvement of layout methodologies and flows
Technologies
Calibre, Klayout, Cadence Allegro, Cadence Innovus, Cadence Virtuoso
Responsibilities
Design and layout advanced substrates and IC packages; Develop and utilize script-based layout tools; Collaborate with design and verification teams to ensure layout meets specifications; Perform design rule checking (DRC) and layout vs schematic (LVS) check; Contribute to the development and improvement of layout methodologies and flows
Seniority
Senior, hands-on IC
