Advanced Package Technology Engineer

USA-Colorado-Fort Collins-4380 Ziegler Road💼 Full-time🗓 2026-09-14 → 2026-09-25

Core

Developing cost-effective, high-performance advanced custom package solutions (2.5D/3D) for ASIC products, ensuring signal integrity, thermal, and structural reliability.

Role type

Senior Advanced Package Technology Engineer

Builds

Advanced custom packaging solutions (flip chip, interposers, substrates) for Broadcom ASICs

Domain

Semiconductor packaging, ASIC development, 2.5D/3D integration

Deliverable

production ML models

Required skills

2.5D/3D packaging development, thermal & mechanical modeling, substrate design, failure analysis, supplier qualification, project management

Preferred skills

Knowledge of advanced silicon fab processes, BOM definition, industry standards & quality systems

Technologies

APD, AutoCAD, Solidworks

Responsibilities

Lead 2.5D/3D technology development and qualification, engage memory suppliers and assembly partners, support NPI and volume ramps, develop alternate sourcing strategies

Seniority

Senior, hands-on IC

Sourced via workday · Listed on CareerPlan, which tracks 70,000+ jobs from 20+ sources.

About Broadcom

Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.