R&D Internship in Semiconductor Power Module 80 - 100 % (f/m/d)
Core
Develop new packaging technologies for high-performance semiconductor power modules for rail, power transmission, renewable energy, and eMobility applications.
Role type
R&D Intern in Semiconductor Power Module Packaging
Builds
Prototypes of IGBT modules for quality assessment and technology development
Domain
Semiconductor manufacturing / Power electronics
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Laboratory work, sample preparation, material characterization, data analysis, statistics, problem-solving
Preferred skills
Design of experiments (DoEs), process optimization, materials optimization
Technologies
Scanning acoustic microscopy, cross-section analysis, electrical testing, reliability testing
Responsibilities
Develop packaging technologies for power electronics modules, support build-up and characterization of IGBT module prototypes, conduct design of experiments for process and materials optimization
Seniority
Intern
