Packaging Engineer
Core
Develop total package solutions including design, process development, qualification, and engineering troubleshooting for integrated power semiconductors.
Role type
Packaging Engineer (NPI)
Builds
Integrated power semiconductor packages
Domain
Semiconductor / Power Delivery
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
lead frame assembly process expertise, wire bonding, flip chip, Al wire, clip parts, assembly material characterization (epoxy/solder/EMC), root cause analysis, engineering troubleshooting
Preferred skills
frame design, thermal and stress characterization, CAD/SolidWorks
Responsibilities
Provide package solution recommendations and frame design/material selection for various assembly types; Handle assembly process and FA quality issues by verifying root causes and problem solving; Lead new package/process/material development and monitoring until mass production
Seniority
Mid-Senior, hands-on IC
