Module Packaging Manager
Core
Lead Design for Manufacturability (DFM) and process engineering for complex module packaging solutions, ensuring robust, reliable, and cost-effective PCB/PCBA designs from concept to mass production.
Role type
Senior IC Module Packaging Manager (DFM & Process Engineering)
Builds
Chip-on-board (CoB), system-in-package (SiP), and other complex module packages for semiconductor power delivery systems.
Domain
Semiconductor industry, Integrated Power Semiconductors, Module Packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
PCB/PCBA design and fabrication, DFM guidelines enforcement, SMT/flip-chip/wire-bond/underfill/molding processes, Failure Analysis (X-ray, SEM/EDX, CSAM, cross-sectioning), Design of Experiments (DOE), root cause analysis (8D, DMAIC), CAD tools (CAM350, Allegro, AutoCAD), IPC standards
Technologies
CAM350, Allegro, AutoCAD
Responsibilities
Conduct design reviews of PCB layout, stack-up, and PCBA assembly drawings; Establish and enforce DFM guidelines for PCB fabrication and PCBA assembly; Collaborate with IC, substrate, and board design teams to optimize yield and reliability; Identify and mitigate manufacturing, testability, and reliability risks; Lead end-to-end engineering development of complex module packages; Own process development and qualification for critical PCBA assembly steps; Lead root cause analysis and resolution of engineering issues during NPI and high-volume manufacturing
Seniority
Senior, hands-on IC
