Senior Principal Packaging Engineer
Core
Define and deliver package solutions for new products and technologies in vehicle electrification, power management, robotics, and high-performance compute/datacenters.
Role type
Senior Principal Packaging Engineer (technical lead)
Builds
Standard and advanced packaging solutions for analog and power delivery applications
Domain
Semiconductor industry, advanced packaging
Required skills
package architecture definition, materials selection, assembly process flow design, cross-functional program leadership, industry trend monitoring, NPI/NTI delivery, feasibility assessment, prototype builds, characterization, qualification, risk retirement, production ramp support
Preferred skills
fan-out packaging, panel-level packaging (PLP), 2.5D/3D integration, chiplets, heterogeneous integration, embedded die/passives, SiP/modules, high-density substrates/RDL, hybrid bonding, high power packaging
Technologies
QFP, QFN, BGA, FCBGA, FCCSP, WLCSP, FOWLP, FOPLP/PLP, SiP/modules, RDL
Responsibilities
Define package architectures, materials, structures, and assembly process flows; Drive complex cross-functional technical programs; Monitor industry trends and define technology roadmaps; Ensure package deliverables for NPI and NTI; Support production ramp and risk retirement
Seniority
Senior, hands-on IC
