Package Design Electrical Engineer
Core
Define optimized IC package design solutions for new products and technologies, ensuring electrical performance, manufacturability, and cost efficiency across frequencies from DC to 100GHz+.
Role type
Senior IC packaging electrical engineer
Builds
High-performance semiconductor packages for analog, RF, automotive, and connectivity applications
Domain
Semiconductor packaging and RF engineering
Required skills
Microelectronics packaging design, Electromagnetic (EM) modeling and simulation, System on Chip (SoC) integration, Printed Circuit Board (PCB) design, IO interface design (LVDS, DDR, SerDes), Back End of Line (BEOL) design
Preferred skills
RF design, GHz wired/wireless modeling, Antenna modeling, Advanced EM tools (HFSS, Q3D, AWR, CST, Keysight EMPro, ADS, Cadence)
Technologies
HFSS, Q3D, AWR, CST Microwave Studio, Keysight EMPro, ADS, Cadence Signal and power integrity tools
Responsibilities
Run EM modeling tools to validate package performance and document results; Collaborate with SoC and PCB teams to optimize package solutions; Provide electrical design rules and models to layout teams for IO and power performance optimization; Supply package electrical data for system-level simulations. (via careerplan.io/jobs/R-10066881-package-design-electrical-engineer-at-nxp)
Seniority
Senior, hands-on IC
