Product Yield Enhancement (PYE) – HBM/DRAM Electrical Failure Analysis (EFA) Engineer
Core
Perform deep-dive root cause analysis for HBM/DRAM backend electrical failures to identify root causes and enable fast, data-driven resolution.
Role type
Product Yield Enhancement (PYE) – Electrical Failure Analysis (EFA) Engineer
Builds
HBM/DRAM products for data center, AI, 5G, and mobile applications
Domain
Semiconductor manufacturing, memory and storage solutions
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
electrical characterization, fault isolation, root cause analysis, data analytics, AI-assisted debugging, semiconductor manufacturing knowledge, circuit design, layout, schematics, Python, Perl, C/C++
Preferred skills
AI automation, data analytics scaling, shift-left optimization
Technologies
Python, Perl, C/C++, in-house bench testers
Responsibilities
Conduct electrical characterization and fault isolation using in-house bench testers and advanced debug methodologies to localize defects for Physical Failure Analysis (PFA), Apply data-driven and AI-assisted approaches to improve failure analysis efficiency and hypothesis convergence, Maintain EFA lab operations, tools, and failure sample tracking in compliance with audit and quality requirements, Partner with Frontend Process and Quality teams to drive corrective actions for yield improvement, Collaborate with Product Engineering (PE) and Test Solution Engineering (TSE) teams to analyze test-related yield issues and support shift-left optimization, Support yield learning across NPI, qualification, ramp, and mature production through structured analysis and technical leadership
Seniority
Mid-level, hands-on IC
