Engineer, HIG-HBM Product System & Engineering (Media Health Manufacturing)
Core
Driving Media Health manufacturing execution for next-generation High Bandwidth Memory (HBM) products, including DRAM die, interface die, and stacked HBM solutions.
Role type
Senior IC manufacturing test and yield engineering specialist
Builds
High-volume manufacturing test flows, device and stack-level yield improvements, and optimized reliability strategies for HBM products
Domain
Semiconductor manufacturing (HBM/DRAM) + Test Engineering
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
CMOS technology, DRAM architecture, device physics, root cause analysis, test flow development, yield improvement, circuit debug, test coverage optimization, Design-for-Test (DFT) strategy, project management, technical decision making
Preferred skills
Semiconductor device/internship experience, data analysis, statistics, Python scripting, JMP
Technologies
Python, JMP, CAD tools, Verilog
Responsibilities
Ensure optimized test coverage on current and future HIG HBM design architectures; Develop, validate, characterize, and qualify next-generation HBM products; Support design verification and in-depth circuit analysis using CAD tools and Verilog simulations; Improve manufacturing test yields and reduce test time; Resolve root causes of manufacturing test flow, qualification, and RMA device issues; Promote innovation to provide technical advantages; Mentor team members; Make final decisions on risk analysis and project prioritization; Collaborate with cross-functional teams (Fab, Design, Technology Development, Quality/Reliability)
Seniority
Senior, hands-on IC with mentorship responsibilities
