Senior Manager, Package PE, Product and System Engineering (High Bandwidth Memory)
Core
Senior leader responsible for HBM package engineering, yield improvement, and failure analysis to ensure high-quality memory solutions for AI and data center applications.
Role type
Senior Manager, Product and System Engineering (High Bandwidth Memory)
Builds
High-performance HBM memory packages for AI, data centers, and intelligent edge applications
Domain
Semiconductor manufacturing, High Bandwidth Memory (HBM), Electrical Engineering
Deliverable
production ML models | product features | infrastructure
Required skills
HBM packaging expertise, electrical failure analysis (EFA), physical failure analysis (PFA), root cause analysis, project management, cross-functional collaboration, technical decision making, leadership development
Preferred skills
Product engineering experience, circuit analysis, manufacturing line yield optimization
Technologies
HBM, DFT (Design for Test), DPM (Defects Per Million), Time0 testing
Responsibilities
Improve assembly test coverage to reduce Time0 and package failure DPM; Optimize electrical test coverages to enhance HBM yield; Debug and resolve qualification and RMA packaging issues through EFA and PFA; Coach and mentor team members to develop future technical leaders; Lead complex multi-disciplinary projects to drive technological solutions
Seniority
Senior Manager, hands-on IC with leadership focus