Staff Engineer, APTD Backgrind/Edge Trim
Core
Developing and scaling mechanical wafer processing modules (edge trim, backgrind, thinning) for next-generation advanced packaging technologies.
Role type
Staff Engineer, Advanced Packaging R&D
Builds
Production-ready mechanical wafer processing modules for advanced memory products
Domain
Semiconductor manufacturing / Advanced Packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Wafer edge trim, backgrind, and thinning process expertise; Experimental design (DOE) and data analysis; Root-cause and failure-mode analysis; Physics-based problem solving; Process integration and yield optimization
Preferred skills
Statistical process control (SPC); Data science fundamentals (Python scripting, automation); Advanced packaging technologies (wafer-level packaging, bonding/de-bonding, 2.5D/3D integration)
Technologies
Python, MS Office, data visualization tools
Responsibilities
Develop and optimize wafer edge trim, backgrind, and thinning processes; Improve process capability, yield, and cost efficiency; Conduct root-cause and failure-mode analyses for wafer damage; Perform fundamental research for ultra-thin wafer processing; Support process transfer and ramp to production
Seniority
Staff, hands-on IC with strategic influence
