Senior Post Fab Module Engineer (MOSFET)
Core
Leading 300mm Post Fab module technology for trench MOSFET and IGBT devices, focusing on wafer thinning, backside metallization, and high-volume manufacturing ramp.
Role type
Senior IC semiconductor module engineer (post-fab)
Builds
Trench MOSFET and IGBT devices for power electronics applications
Domain
Semiconductor manufacturing (back-end processing)
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Wafer thinning, backside metallization (Al/Ti/NiV/Ag stacks), stress and thermal management on thinned wafers, process roadmap ownership, PFMEA and risk mitigation, tool qualification and matching, statistical process control (SPC), design of experiments (DOE), yield improvement, cross-functional collaboration, technical mentorship
Preferred skills
None stated
Technologies
300mm wafer processing, back-grind, back-metallization line, SPC tools, DOE tools, failure analysis equipment
Responsibilities
Own process roadmap and module technology direction; set process standards and act as go-to expert for manufacturability; lead scaling from development to high-volume manufacturing; evaluate and qualify new materials, processes, and equipment; troubleshoot process issues to improve yield; lead tool matching and variation reduction; self-manage technical projects and mentor engineers; analyze process data using statistical methods
Seniority
Senior, hands-on IC with team leadership