Principal Process Engineer
Core
Senior technical leader driving project leadership and deep subject matter expertise in post-Fab wafer processing (backgrind, thinning, metallization) to optimize manufacturing performance and ensure product reliability.
Role type
Principal Process Engineer (Senior, hands-on IC)
Builds
Wafer processing capabilities for die assembly, test, and long-term product reliability
Domain
Semiconductor manufacturing (post-Fab wafer processing)
Deliverable
production ML models | product features
Required skills
Wafer backgrind, thinning, and metallization process expertise; Semiconductor failure analysis techniques; Advanced data analytics and statistical learning; AI-assisted data analysis and automation tools; Root cause investigation; Cross-functional collaboration; Executive-level presentation
Preferred skills
Post-graduate degree (Master's or PhD); Experience applying data analytics, statistical methods, or AI-assisted tools in semiconductor manufacturing
Technologies
AI-enabled analytics tools; Statistical learning frameworks; Automation tools
Responsibilities
Serve as principal technical expert for wafer backgrind, thinning, and metallization processes; Lead post-Fab process development, optimization, and sustainment; Apply AI-assisted data analysis to identify process trends and anomalies; Partner with Fab, Assembly, Test, Quality, Equipment, IT, and suppliers to deploy data-driven solutions; Own and execute high-impact, self-directed technical and manufacturing projects; Anticipate technical risks and define mitigation strategies; Prepare and deliver analytics-based reports translating process insights into business impact
Seniority
Principal, strategy & mentorship