Wafer Saw Process Engineer
Core
Sustain and optimize Wafer Saw (Die Preparation) processes to improve yield, quality, cycle time, and cost while supporting capacity expansion.
Role type
Process Engineer (Wafer Saw / Die Preparation)
Builds
Semiconductor manufacturing processes and die preparation equipment
Domain
Semiconductor manufacturing
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Wafer Saw process optimization, defect analysis (chipping, cracking, contamination), SPC, FMEA, DOE, root cause analysis, supplier qualification, process documentation, capacity planning
Preferred skills
Experience in different FOL processes
Technologies
DFD6240, DFD6340/1, DFD6361/2, ADT2000, Laser Groove equipment
Responsibilities
Define and optimize sawing parameters, lead failure analysis for die defects, establish SPC controls and control plans, support new product introduction, implement cost reduction and productivity improvements, manage capacity expansion initiatives
Seniority
Mid-level, hands-on IC