Engineer, HIG-HBM Product System & Engineering (Media Health Manufacturing)
Core
Lead Media Health Manufacturing and test flow development for Micron's next-generation High Bandwidth Memory (HBM) products, focusing on DRAM, Interface, and Stacked Die architectures.
Role type
Senior IC Product System & Engineering Lead (HBM Manufacturing)
Builds
Next-generation HBM products (DRAM, Interface, Stacked Die) for data center and AI applications
Domain
Semiconductor manufacturing, High Bandwidth Memory (HBM), DRAM architecture
Required skills
HBM product validation, manufacturing test flow development, circuit debug, yield improvement, DFT strategy, root cause analysis, cross-functional collaboration, project management, technical decision making
Preferred skills
Semiconductor device experience, CMOS technology knowledge, DRAM architecture familiarity, Python/JMP scripting, data analysis
Technologies
CAD tools, Verilog simulations, Python, JMP
Responsibilities
Optimize test coverage for HBM design architectures; Develop and validate next-generation HBM products; Support new product design verification using CAD and Verilog; Improve manufacturing yields and reduce test time; Resolve manufacturing test flow and RMA device issues; Mentor team members; Manage project execution and technical priorities; Collaborate with Fab, Design, and Quality teams
Seniority
Senior, hands-on IC with leadership responsibilities