Engineer, HIG-HBM Product System & Engineering (Media Health Manufacturing)
Core
Lead manufacturing test flow development, validation, and yield improvement for Micron's next-generation High Bandwidth Memory (HBM) products across DRAM, Interface, and Stacked Die architectures.
Role type
Senior IC Product System & Engineering Manager (HBM Manufacturing)
Builds
High Bandwidth Memory (HBM) DRAM and Stacked Die products for data center and AI applications
Domain
Semiconductor manufacturing, HBM technology, DRAM architecture
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
HBM product validation, manufacturing test flow development, circuit debug, yield improvement strategies, DFT strategy, root cause analysis, project management, cross-functional collaboration
Preferred skills
Semiconductor device physics, CMOS technology, Python scripting, JMP data analysis, design verification
Technologies
Verilog, CAD tools, Python, JMP
Responsibilities
Optimize test coverage for current and future HIG HBM design architectures; Develop, validate, and qualify next-generation HBM products; Support new product design verification using CAD and Verilog simulations; Improve manufacturing test yields and reduce test time; Resolve root causes of manufacturing test flow, qualification, and RMA device issues; Mentor team members and drive project execution; Make technical decisions on risk analysis and project prioritization
Seniority
Senior, hands-on IC with leadership responsibilities