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DRAM Architect – Principal Engineer | MTS - TPG

Boise, ID - Main Site💼 Full-time🗓 2026-05-12 → 2026-07-31

Core

Develop system-level solutions, tools, and methodologies to optimize DRAM performance, power efficiency, and cost while pioneering new memory features.

Role type

Principal DRAM Architect (MTS level)

Builds

High-quality, reliable, and power-efficient DRAM solutions for global markets

Domain

Semiconductor / Memory and Storage

Deliverable

production ML models | product features

Required skills

DRAM architecture design, system-level optimization, power/performance/cost trade-off analysis, cross-functional collaboration, technical mentorship

Preferred skills

Advanced memory technology expertise (LPDDR5/6, DDR5/6, GDDR6/7, HBM3E/4), industry trend analysis, creative problem-solving

Technologies

LPDDR5/6, DDR5/6, GDDR6/7, HBM3E/4

Responsibilities

Develop system-level solutions and tools for DRAM optimization; Collaborate with multi-functional teams to implement innovative memory solutions; Analyze system behavior to drive data-driven optimizations; Drive architectural innovation for current and future DRAM generations; Mentor team members through training and technical guidance

Seniority

Principal, hands-on IC with strategy & mentorship

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