Intern - Process Integration, Advanced Packaging
Core
Support the development of sophisticated interconnect technologies and advanced packaging solutions through experimental design, line monitoring, and data analysis.
Role type
Intern, process integration engineer (advanced packaging)
Builds
Next-generation memory technologies and advanced interconnect/packaging solutions
Domain
Semiconductor manufacturing, advanced packaging, interconnect technologies
Deliverable
production ML models
Required skills
Design of Experiments (DoE), structured problem-solving (Kepner-Tregoe), data analysis (JMP, system analytics), experimental design, line monitoring, project management, AI tool usage
Preferred skills
Semiconductor process integration experience, statistical analysis tools, advanced packaging knowledge
Technologies
JMP, Micron systems, AI tools and agents
Responsibilities
Lead problem-solving activities using structured methodologies; Define and implement Design of Experiments (DoE); Support line monitoring and yield improvement initiatives; Conduct experimental work and document outcomes; Analyze results and provide actionable recommendations.
Seniority
Intern