Advanced Package Technology Development PI Staff Engineer
Core
Lead and manage Advanced Package Technology Development strategies to build high-performing, cost-effective packaging solutions with predictable reliability for memory and storage products.
Role type
Staff Engineer (Technology Development & Strategy)
Builds
Advanced packaging solutions (2.5D, 3DIC, FO, hybrid bond) for memory and storage products
Domain
Semiconductor manufacturing / Advanced Packaging
Required skills
Advanced package process development, 2.5D/3DIC/FO/hybrid bond architecture, process flow analysis, yield/performance/reliability optimization, failure analysis, electronic materials properties, root cause troubleshooting, strategic planning, cross-functional leadership, data analysis (JMP, system data mining), AI tool utilization
Preferred skills
MS or Ph.D in Electrical/Computer Engineering/Chemistry/Physics/Materials, 5+ years packaging industry experience (3+ in advanced package), mentoring experience, flexible resource management
Technologies
JMP, Large Language Models, Claude code, probe testing, parametric testing, backend testing, reliability testing
Responsibilities
Develop and communicate technology development strategies aligned with business objectives, set long-term technical objectives, provide technical leadership to influence company direction, represent assembly team in cross-functional initiatives, ensure quality improvements and cost control, mentor functional leaders, troubleshoot complex problems and address root causes
Seniority
Staff, strategic leadership with hands-on technical expertise