Sr. Mgr, Package Engineering
Core
Leading complex joint development projects (JDPs) and research programs to drive advanced packaging technology leadership and heterogeneous integration solutions for customers.
Role type
Senior Manager, Ecosystem & Program Management
Builds
Virtual integration center, industry standards, and differentiated packaging solutions for AI/HPC/memory architectures
Domain
Semiconductor manufacturing / Advanced Packaging
Required skills
Program management, stakeholder management, strategic planning, cross-functional leadership, ecosystem orchestration, project execution, business case development, technical strategy, negotiation, change management
Preferred skills
Joint development project (JDP) initiation, R&D team leadership, semiconductor industry experience, industry network building, decision-making in ambiguity
Technologies
Advanced packaging technologies, heterogeneous integration, AI/HPC/memory architectures, test vehicles
